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Chapter Glossary
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Recovery  the first stage in the removal of the effects of cold working when a cold-worked metal is slowly heated with increasing temperature. During recovery, internal stresses are relieved and some dislocation rearrangement into lower-energy configura-tions takes place. Some dislocations are annihilated.
(See page(s) 274, Sec. 6.1)
Recrystallization  the process whereby a cold-worked metal is heated to a sufficiently high temperature for a long enough time to form a new strain-free grain structure. During recrystallization the dislocation density of the metal is greatly reduced.
(See page(s) 274, Sec. 6.1)
Ductile fracture  a mode of fracture characterized by slow crack propagation. Ductile fracture surfaces of metals are usually dull with a fibrous appearance.
(See page(s) 274, Sec. 6.2)
Brittle fracture  a mode of fracture characterized by rapid crack propagation. Brittle fracture surfaces of metals are usually shiny and have a granular appearance.
(See page(s) 274, Sec. 6.2)
Fatigue  the phenomenon leading to fracture under repeated stresses having a maximum value less than the ultimate strength of the material.
(See page(s) 274, Sec. 6.3)
Fatigue failure  failure that occurs when a specimen undergoing fatigue fractures into two parts or otherwise has been significantly reduced in stiffness.
(See page(s) 274, Sec. 6.3)
Fatigue life  the number of cycles of stress or strain of a specific character that a sample sustains before failure.
(See page(s) 274, Sec. 6.3)
Fatigue crack growth rate da/dN  The rate of crack growth extension caused by constant-amplitude fatigue loading.
(See page(s) 274, Sec. 6.4)
Creep  time-dependent deformation of a material when subjected to a constant load or stress.
(See page(s) 274, Sec. 6.5)
Creep rate  the slope of the creep-time curve at a given time.
(See page(s) 274, Sec. 6.5)
Creep (stress)-rupture strength  the stress that will cause fracture in a creep (stress-rupture) test at a given time and in a specific environment at a particular temperature.
(See page(s) 274, Sec. 6.5)







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